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Digital Camera Patent Abstract
A digital camera module (10) for a portable electronic device includes
a barrel (12) containing a first lens (122) and a second lens (124),
a holder (15) containing part of the barrel, and an image sensor
(141) below the first and second lenses. The first and second lenses
are adhered in the barrel by an ultraviolet (UV) adhesive. The UV
adhesive is cured between 75.degree. Celsius and 100.degree. Celsius
for 20 to 30 minutes, and is volatilized little. The image sensor
is packaged with a Ceramic Leaded Chip Carrier. The structure of
the digital camera module can effectively protect the first and
second lenses thereof from moisture, dampness, and oxidation.
Digital Camera Patent Claims
I claim:
1. A camera module for a portable electronic device, comprising:
a barrel; a first lens adhered in the barrel by an ultraviolet (UV)
adhesive, the UV adhesive cured between 75.degree. Celsius and 100.degree.
Celsius for 20 to 30 minutes whereby the UV adhesive is volatilized
little; a holder retaining part of the barrel; and an image sensor
below the first lens, the image sensor being packaged with a Ceramic
Leaded Chip Carrier.
2. The camera module as claimed in claim 1, further comprising
a second lens adhered in the barrel below the first lens by the
UV adhesive, the UV adhesive cured between 75.degree. Celsius and
100.degree. Celsius for 20 to 30 minutes whereby the UV adhesive
is volatilized little.
3. The camera module as claimed in claim 2, wherein the first lens
is an aspheric glass lens.
4. The camera module as claimed in claim 3, wherein the second
lens is an aspheric plastic lens, and is symmetrically opposite
to the first lens.
5. The camera module as claimed in claims 2, wherein the first
lens comprises an AR-Coating provided thereon.
6. The camera module as claimed in claim 5, wherein said AR-Coating
comprises alternately stacked layers of silicon dioxide (SiO.sub.2)
and tantalum pentoxide (Ta.sub.2O.sub.5).
7. The camera module as claimed in claim 5, wherein the first lens
comprises an IR-Cut Coating provided thereon.
8. The camera module as claimed in claim 7, further comprising
a glass plate fixed in the holder between the barrel and the image
sensor.
9. The camera module as claimed in claim 7, further comprising
a cover fixed on a top of the barrel.
10. The camera module as claimed in claim 1, wherein the image
sensor is a Complementary Metal-Oxide Semiconductor type sensor
or a Charge Coupled Device.
11. An image pick-up module for a portable electronic device, comprising:
a lens receiver used to receive at least one lens therein and allow
an image incident light passing through said at least one lens;
an adhesive for attaching said at least one lens to said lens receiver
and having said at least one lens fixed therein, said adhesive applied
to a periphery of said at least one lens with a significantly small
area, and having a property of slow volatilization; and an image
sensor spaced from said lens receiver for accepting illumination
of said incident light passing through said at least one lens and
generating image signals corresponding to said incident light.
12. The image pick-up module as claimed in claim 11, wherein said
adhesive is an ultraviolet (UV) adhesive, and is treated by UV illumination
and cured in a predetermined temperature range for a predetermined
curing period so as to fix said at least one lens to said lens receiver.
13. The image pick-up module as claimed in claim 11, wherein said
at least one lens is coated so as to turn from a hydrophilic condition
to a hydrophobic condition.
14. The image pick-up module as claimed in claim 11, wherein said
at least one lens has an antireflective coating thereon.
15. The image pick-up module as claimed in claim 11, wherein said
image sensor is packaged with a Ceramic Leaded Chip Carrier.
16. A method for installing an image pick-up module of a portable
electronic device and enhancing performance thereof, comprising
the steps of: providing a lens receiver having a path therein for
an image incident light passing along said path; fixing at least
one lens interferingly in said path and to said lens receiver with
an slowly volatile adhesive by applying a predetermined treatment
on said adhesive; and installing an image sensor spaced from said
lens receiver for accepting illumination of said image incident
light and generating image signals corresponding to said incident
light.
17. The method as claimed in claim 16, further comprising the step
of coating said at least one lens so as to turn said at least one
lens from a hydrophilic condition to a hydrophobic condition.
18. The method as claimed in claim 16, wherein said predetermined
treatment includes applying ultraviolet (UV) light on said adhesive
and curing said adhesive in a temperature range of 75.degree. Celsius
and 100.degree. Celsius for 20 to 30 minutes.
19. The method as claimed in claim 16, wherein said image sensor
is packaged with a Ceramic Leaded Chip Carrier.
Digital Camera Patent Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention generally relates to digital camera
modules, and more particularly to a digital camera module which
is used in portable electronic devices such as digital cameras and
video cameras.
[0003] 2. Prior Art
[0004] Currently, digital camera modules are in widespread use
in a variety of portable electronic devices. Most portable electronic
devices are becoming progressively more miniaturized over time,
and digital camera modules are correspondingly becoming smaller
and smaller. For example, digital camera modules are now widely
available as a feature of a mobile phone. Nevertheless, in spite
of the small size of a contemporary digital camera module, consumers
still demand excellent imaging. The quality of the image provided
is mainly dependent upon the optical elements of the digital camera
module.
[0005] A contemporary digital camera module generally includes
a holder, a barrel, several lenses, and an image sensor underlying
the lenses. The lenses are adhered in the barrel. The image sensor
is packaged by a Plastic Leaded Chip Carrier (PLCC), and is electronically
connected with a Printed Circuit Board (PCB). During the process
of applying and solidifying the adhesive, it is easily volatilized.
The volatilized adhesive is then liable to solidify on surfaces
of the lenses. The light transmittance ratio of the lenses is reduced,
and the image obtained by the image sensor is impaired. Additionally,
the technology of PLCC packaging is complex and expensive, and a
PLCC package generally has poor damp proofing, antisepsis, and anti-oxidation
characteristics. Furthermore, some of the lenses may be coated with
a magnesium fluoride (MgF.sub.2) film. The MgF.sub.2 film easily
absorbs moisture, and generally has poor antisepsis characteristics.
[0006] Therefore, a digital camera module that can help overcome
the above-described problems and improve image quality is desired.
SUMMARY OF THE INVENTION
[0007] Accordingly, an object of the present invention is to provide
a digital camera module which can help prevent fouling of lenses
thereof and improve image quality.
[0008] To achieve the above-mentioned object, a preferred digital
camera module for a portable electronic device includes a barrel
containing a first lens and a second lens, a holder containing part
of the barrel, and an image sensor below the first and second lenses.
The first and second lenses are adhered in the barrel by an ultraviolet
(UV) adhesive. The UV adhesive is cured between 75.degree. Celsius
and 100.degree. Celsius for 20 to 30 minutes, and is volatilized
little. The image sensor is packaged with a Ceramic Leaded Chip
Carrier. The structure of the digital camera module can effectively
protect the first and second lenses thereof from moisture, dampness,
and oxidation.
[0009] Other objects, advantages and novel features of the invention
will become more apparent from the following detailed description
when taken in conjunction with the accompanying drawings, in which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 is a schematic, cross-sectional view of a digital
camera module in accordance with the preferred embodiment of the
present invention, the digital camera module including a first lens
and a second lens; and
[0011] FIG. 2 is an enlarged, cross-sectional view of the first
lens and the second lens of the digital camera module of FIG. 1,
but showing the first and second lenses in close proximity to each
other.
DETAILED DESCRIPTION OF THE INVENTION
[0012] Referring to FIG. 1, an image pick-up module like a digital
camera module 10 includes a cover 11, a barrel 12 as a lens receiver,
a first lens 122, a second lens 124, a glass plate 13, a packaged
image sensor 14 and a holder 15. The image sensor 14 includes an
imaging surface 141, and is packaged on a Flexible Printed Circuit
Board (FPC) 17 via a Ceramic Leaded Chip Carrier (CLCC) 16. Part
of the barrel 12 is inserted into and engaged in the holder 15.
Both the first lens 122 and the second lens 124 are contained in
the barrel 12.
[0013] The cover 11 is circular, and is fixed on a top of the barrel
12. The cover 11 defines two opposite central openings 112, 114
at two opposite sides thereof. Therefore incident light can penetrate
the cover 11, transmit to the first lens 122, and then to the second
lens 124. A proofing lens (not shown) can also be provided between
the opening 112 and the opening 114, to protect the digital camera
module 10 against dust and contamination.
[0014] Referring also to FIG. 2, the first lens 122 and the second
lens 124 are both used to focus the incident light. The first lens
122 and the second lens 124 are adhered in the barrel 12 by the
adhesive 18 at each periphery of the first lens 122 and the second
lens 124 which has a significantly small area and is placed in a
threaded inner surface of the barrel 12. In the preferred embodiment
of the invention, the adhesive 18 is OPTOCAST 3410, which is a kind
of ultraviolet (UV) adhesive produced by Electronic Material Inc.
(EMI) of Britain. After the adhesive 18 is applied, the lenses 112,
114 are baked twice. In the first baking, the temperature is held
between 75.degree. Celsius and 85.degree. Celsius for 20 to 30 minutes.
In the second baking, the temperature is held between 90.degree.
Celsius and 100.degree. Celsius for 20 to 30 minutes. Throughout
both baking processes, the adhesive 18 is volatilized little.
[0015] The first lens 122 has an outwardly protruding sub-hemispherical
central portion, which defines two aspheric surfaces 1222 and 1224.
The aspheric surface 1222 protrudes outwardly. The aspheric surface
1222 is made of glass, so that it can resist dampness, high temperatures,
and abrasion. The first lens 122 is alternatively coated to turn
from a hydrophilic condition of glass to a hydrophobic condition.
The second lens 124 is similar in shape but symmetrically opposite
to the first lens 122. The second lens 124 is made of an optical
plastic, which can be acrylic resin, polymethyl methacrylate (PMMA),
or polycarbonate (PC).
[0016] Additionally, a film of AR-Coating (antireflective coating)
can be provided on the aspheric surface 1222 of the first lens 122.
The AR-Coating comprises alternately stacked layers of silicon dioxide
(SiO.sub.2) and tantalum pentoxide (Ta.sub.2O.sub.5). Therefore,
the light transmittance ratio of the first lens 122 is increased,
and the reflectivity of the first lens 122 is decreased. Furthermore,
a film of IR-Cut Coating can be provided on the aspheric surface
1224 of the first lens 122. This film can prevent incident infrared
light rays from reaching the image sensor 14.
[0017] The glass plate 13 is contained and fixed in the holder
15 between the barrel 12 and the image sensor 14, and is for protecting
the imaging surface 141 of the image sensor 14. The image sensor
14 can be a Complementary Metal-Oxide Semiconductor (CMOS) type
sensor or a Charge Coupled Device (CCD). A plurality of wires 164
connects the image sensor 14 with a hollow, cylindrical leading-out
terminal 162, which in turn is adapted to be electrically connected
with the FPC 17. The image sensor 14 can thus convey electrical
signals to the FPC 17. The holder 15 is a hollow cylinder, and defines
two opposite openings (not labeled). A top one of the openings has
said part of the barrel 12 engaged therein, and the other bottom
opening has the image sensor 14 and the CLCC 16 received therein.
[0018] In assembly, the glass plate 13 is inserted into and fixed
in the holder 15. The image sensor 14 attached on the CLCC 16 is
inserted into the holder 15 through the bottom opening thereof,
and fixed in the holder 15. The first lens 122 and the second lens
124 are inserted into and fixed in the barrel 12. Said part of the
barrel 12 is inserted into and engaged in the holder 15. Finally,
the cover 11 is fixed on the top of the barrel 12. The structure
of the digital camera module 10 of the present invention can effectively
protect the first and second lenses 122, 124 thereof from moisture,
dampness, and oxidation.
[0019] It is believed that the present invention and its advantages
will be understood from the foregoing description, and it will be
apparent that various changes may be made thereto without departing
from the spirit and scope of the invention or sacrificing all of
its material advantages. The examples hereinbefore described are
merely preferred or exemplary embodiments of the invention. |